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PICMG 2.11 R1.0
Compact PCI
Power Interface
Specification
October 1,1999
Copyright 1995,1996,1997,1999 PCI Industrial Computers Manufacturers Group (PICMG).
The attenti on of adopters i s di rected to the possi bi I ity that compl i ance with or adopti on of
PICMG specifications may require use of an invention covered by patent rights
PICMG shall not be responsible for identifying patents for which a license may be
required by any PICMG specification, or for conducting legal inquiries into the legal
validity or scope of those patents that are brought to its attention. PICMG specifications
are prospective and advisory only. Prospective users are responsible for protecting
themselves against liability for infringement of patents
NOTICE:
The information contained in this document is subject to change without notice. The
material in this document details a PICMG specification in accordance with the license
and notices set forth on this page. This document does not represent a commitment to
implement any portion of this specification in any company's products
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE
ACCURATE, PICMG MAKES NO WARRANTY OF ANY KIND, EXPRESS OR
IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT
LIMITED TO ANY WARRANTY OF TITLE OR OWNERSHIP, IMPLIED
WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR
PARTICULAR PURPOSE OR USE.
In no event shall PICMG be liable for errors contaned herein or for indirect, incidental,
special, consequential, reliance or cover damages, including loss of profits, revenue, data
or use, incurred by any user or any third party.
Compliance with this specification does not absolve manufacturers of CompactPCI
equipment from the requirements of safety and regulatory agencies (UL, CSA, FCC, I EC,
etc.).
PICMG , CompactPCI , and the PICMG and CompactPCI logos are registered
trademarks of the PCI Industrial Computer Manufacturers Group.
All other brand or product names may be trademarks or registered trademarks of their
respective holders.
Contents
I OVERVIEW..................................................................7
1.1 Introduction...............................................................7
1.2 Background and Terminology.................................................7
1.3 Scope......................................................................8
1.4 Desired Audience...........................................................8
1.5 Applicable Documents.......................................................9
1.6 Administration............................................................11
1.7 Name And Logo Usage.......................................................12
2 ELECTRICAL REQUIREMENTS...................................................13
2.1 Rower Supply Design Rules.................................................13
2 . /. / Additional Wann Swap Power Supply Design Rules For Hot Swap Systems.. 13
2 .1.2 Design notes:........................................................ 14
2.2 Backplane/Platform Design Rules...........................................14
2.2 . / Design notes:.......................................................15
3 MECHANICAL REQUIREMENTS......................................................16
3.1 Boa rd Requ i rem ents.................................................16
3.1.1 Additional Warm Swap Pou er Supply Design Rules For Hot Swap Systems. 17
3.1.2 Front Panel Keying....................................................22
3.2 Backplane/Platform Requirements...........................................24
3.2.1 Additional Warm Swap Power Supply Design Rules For Hot Swap Systems...24
4 SAFETY AGENCY ISSUES.........................................................27
5 CONNECTOR IMPLEMENTATION.....................................................29
5.1 Introduction..............................................................29
5.2 Connector Gui delines.....................................................30
5.3 Connector Requi rem ents..................................................30
5.3.1 Power Connector Environmental Requirements............................31
5.3.2 Power Connector Pin Requirements......................................32
5.4 Rower Connector Description...............................................38
5.5 Modular Rower Supply Connector Rnout......................................39
6 APPENDICES...................................................................41
7 REVISION HISTORY.............................................................92
October 1,1999
iii
Tables
Tablei RowerSupply Geographic Addressing.................................15
TABLE2 ChamberD, E, and A, В KeyCodesforAC Input Rower Supplies..........22
Tables ChamberD, E, and A, В Key CodesforDC Input Rower Supplies.........23
Table4 Reserved Chamber D and A Key Codes................................23
Tables Chamber F and C Key Codes for Output Rower........................23
Table6 Modular Rower Operation...........................................33
Table? Physical Slot Addresses...........................................36
Tables I nteroperability Signal Requirements............................37
Table 9 Rower Connector Rn Assignments....................................39
Table 10 Rower Connector Selective Rn Loading..............................40
Table 11 Modular Rower Supply Operation....................................41
Table 12 Revision History..................................................92
Illustrations
Figure 1 Cross Sectional Board, Connector, Backplaneand Front Panel View...18
Figure2 C omponent Outline................................................19
Figure 3 3U Board Connector Location Dimensions............................20
Figure 4 6U Board Connector Location Dimensions............................21
Figure 5 3U Backplane Dimensionswith Rower Connector.......................25
Figure 6 6U Backplane Dimensionswith Rower Connector.......................26
Figure? VoltageAdjust.....................................................35
Figures Existing Practice for DIN Type M RowerSupply Connector............43
Figure9 E xisting Practice: 3U Backplane Dimensionswith DIN TypeM Rower Connector.... 44
Figure 10 Existing Practice for 38 Position Rower Connector and Rn Definitions.45
vi
CompactPCI Power Interface Specification PICMG 2.11 R1.0
1 Overview
1.1 Introduction
PICMG 2.11 defines the el ectri cal and mechanical interfaces, and minimum
requirements for modular CompactPCI pluggable power suppliesand related
CompactPCI platforms based on the CompactPCI core specification PICMG 2.0
R2.1. Although the CompactPCI core specification PICMG 2.0 R2.1 defines an
opti onal pl uggabl e power suppl у connector i nterf ace; thi s i nterf ace i s i nadequate to
support many higher power applications. This specification, PICMG 2.1, provides a
defined interface to support higher power supply output current levels and 6U form
factor power supplies, as well as providing some additional functionality to support
Hot Swap applications, and agrowth path for high availability systems.
CompactPCI is an open specification supported by the PICMG (PCI Industrial Com-
puter Manufacturers Group), which isaconsortium of companies involved in utilizing
PCI for embedded applications. PICMG controls this specification.
1.2 Background and Terminology
Dual Redundant - Describesan environment containing two power supplies, with
fault tolerance such that one power supply may fail and the system will continue to
operate.
Eurocard - A series of mechanical board form factor sizes for rack-based systems as
used in VME, Multibus II, and other applications defined by the I nstitute of Electrical
and Electronics Engineers (IEEE) and International Electrotechnical Committee
(I EC).
ISA - Industry Standard Architecture. A specification by which Personal Computers
(PCs) add boards.
Hot Swap - An environment supporting removal and insertion of application boards
while under power, wherein the system continues to operate. In this specification,
Hot Swap specifically refers to the PICMG 2.1 CompactPCI Hot Swap Specification.
N+l Redundant - Describes an environment containing more than two power
supplies, where the power supplies typical I у current share, with fault tolerance such
that one power supply may fail and the system will continue to operate.
PCI - Peripheral Component Interconnect. A specification for defining acommon
interconnect between logic components. Typically used for interconnecting high-
speed, PC-compatible chipset components. The PCI specification is issued through
the PCI Special Interest Group (PCI SIG).
Platform - Describes the system environment, including the backplane and related
enclosure.
Warm Swap - An environment supporting removal and insertion of power supplies
while under power, wherein the power supply is disabled during insertion and
removal, avoidi ng the need for the connectors to make and break high current
connect! ons whi I e under I oad.
This specification utilizes several key words, which are defined below:
may: A key word indicating flexibility of choice with no implied preference.
shall: A key word i ndi cati ng a mandatory requi rement. Desi gners shall i m-
plement such mandatory requirements to ensure interchangeability and
to claim conformance with the specification.
should: A key word indicating flexibility of choice with astrongly preferred
implementation.
1.3 Scope
The scope of this specification covers 3U and6U IEEE 1101.x compatible modular
pluggable power supply modules and platforms that support pluggable power supply
modules.
This specification is intended to cover modular pluggable power supplies in the power
range of 100 W to 600 W.
1.4 Desired Audience
CompactPCI exists to provide a standard form factor for those applications requiring
the high performance of PCI as well as the small size and ruggedness of a rack mount
system. CompactPCI provides a mechanism for OEM and end users to directly apply
PCI components and technology to a new mechani cal form factor whi I e mai ntai ni ng
compatibility with existing operating systems and application software availablefor
desktop PCI.
Pluggable power suppliesexist to provide a reliable, convenient mechanism for power
supply servicing via front panel access. This is particularly useful for hot swap
systems and high availability systems with dual redundant or N+1 redundant power
supplies.
1.5 Applicable Documents
Ths CompactPCI Specification builds on several industry standards You should
reference the fol lowing list of publications while reading this specification.
• PICMG 2.0, CompactPCI Specification, Revision 3.0,
PCI Industrial Computer manufacturers Group (PICMG),
401 Edgewater Place, Suite500, Wakefield, MA 01880 USA,
Tel: 781.224.1100, Fax: 781.224.1239, www.picmg.org
• PICMG 2.1 CompactPCI Hot Swap Specification, Revision 1.0,
PCI Industrial Computer manufacturers Group (PICMG),
401 Edgewater Place, Suite500, Wakefield, MA 01880 USA,
Tel: 781.224.1100, Fax: 781.224.1239, www.picmg.org
• PICMG 2.5 CompactPCI Computer Telephony Specification, Revision 1.0,
PCI Industrial Computer manufacturers Group (PICMG),
401 Edgewater Place, Suite500, Wakefield, MA 01880 USA,
Tel: 781.224.1100, Fax: 781.224.1239, www.picmg.org
• PCI Local Bus Specification, Revision 2.1
PCI Special Interest Group,
5200 N. E. Elam Young Parkway,
Hillsboro, Oregon, USA, 9724-6497,
(503) 696-2000www.pcisig.com
• PCI Hot-Plug Specification, Revision 1.0
PCI Special Interest Group,
5200 N. E. Elam Young Parkway,
Hillsboro, Oregon, USA, 9724-6497,
(503) 696-2000 www.pcisig.com
• PCI Power Management Interface Specification, Revision 1.0
PCI Special Interest Group,
5200 N. E. Elam Young Parkway,
Hillsboro, Oregon, USA, 9724-6497,
(503) 696-2000www.pcisig.com
• I EC 60297-3 and I EC 60297-3-am1 Dimensions of mechanical structures of
the 482.6 mm (19 in) series. Part 3: Subracks and associated plug-in units,
Bureau Central de la Commission Electrotechnique Internationale,
1 ruedeVarembe, Geneva, Switzerland, 011.412.291.90228
• I EC 60297-4, Mechanical structures for electronic equipment - Dimensions of
mechanical structures of the 482,6 mm (19 in) series - Part 4: Subracks and
associated plug-in units - Additional dimensions,
Bureau Central de la Commission Electrotechnique Internationale,
1 ruedeVarembe, Geneva, Switzerland, 011.412.291.90228
• I EC-61076-4-101, Specification for 2 mm Connector Systems,
International Electrotechnical Commission,
American National Standards Institute,
11 West 42nd Street, 13th Floor, New York, NY, USA 10036
• I EEE 1101.1 -1991, IEEE Standard for Mechanical Core Specifications for
Microcomputers Using IEC 603-2 Connectors,
Institute of Electrical and Electronics Engineers, Inc.,
445 Hoes Lane, P.O. Box 1331, Piscatoway, NJ, USA, 08855-1331
• I EEE 1101.10, IEEE Standard for Additional Mechanical Specifications for
Microcomputers using IEEE 1101.1 Equipment Practice,
Institute of Electrical and Electronics Engineers, Inc.,
445 Hoes Lane, P.O. Box 1331, Piscatoway, NJ, USA, 08855-1331
• I EEE 1101.11, IEEE Standard for Additional Mechanical Specifications for
Microcomputers using IEEE 1101.1 Equipment Practice,
Institute of Electrical and Electronics Engineers, Inc.,
445 Hoes Lane, P.O. Box 1331, Piscatoway, NJ, USA, 08855-1331
• UL 94V0, TESTS FOR FLAMMABILITY OF PLASTIC MATERIALS FOR
PARTS IN DEVICES AND APPLIANCES,
Underwriters laboratories Inc.
333 Plingsten Road
Northbrook, IL 60062-2096
• UL 1950, SAFETY OF INFORMATION TECHNOLOGY EQUIPMENT,
INCLUDING ELECTRICAL BUSINESS EQUIPMENT,
Underwriters laboratories Inc.
333 Plingsten Road
Northbrook, IL 60062-2096
• EN 60950, SPECIF IC A TION FOR SA FETY OF INFORMA TION
TECHNOLOGY EQUIPMENT, INCLUDING ELECTRICAL BUSINESS
EQUIPMENT
European Committee for Electrotechnical Standardization
Rue de Stassart, 35
В - 1050 BRUSSELS
• U L1977, COMPONENT CONNECTORS FOR USE IN DA TA, SIGNA L,
CONTROL AND POWER APPLICATIONS,
Underwriters laboratories Inc.
333 Plingsten Road
Northbrook, IL 60062-2096
• CSA C22.2 No 182.3-M1987, Special Use Attachment Plugs, Receptacles,
and Connectors,
Canadian Standards Association
178 Rexdal e Boul evard
Etobicoke, Ontario, Canada M9W 1R3
• I EC 60512-2, -3, -4, -5, -7, -8,-9, ELECTROMECHANICAL COMPONENTS
FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURESAND
MEASURING METHODS PART 2, 3, 4, 5, 7,8, 9 Bureau Central de la
Commi ssi on El ectrotechni que I nternati onal e, 1 rue de V arembe,
Geneva, Switzerland, 011.412.291.90228
• ANSI/EIA 364-C-1994, ELECTRICAL CONNECTOR TEST PROCEDURES
INCLUDING ENVIRONMENTAL CIASSIFICATIONS,
American National Standards Institute,
11 West 42nd Street, 13th Floor, New York, NY, USA 10036
• Bellcore FR-2063, Network Equipment Building System (NEBS) Family of
Requirements (NEBSFR) (with particular emphasis on sub-documents
Bellcore SR-3580, Bellcore GR-63-CORE, Bellcore GR-1089-CORE)
Bellcore,
8 Corporate pl ace, Room ЗА-184
Piscateway, New Jersey 08854-4156
• VITA 30 - 199x (draft), 2mm Connector Practice for Euroboard Systems
VITA Standards Organi zati on,
7825 E. Gelding Drive, Suite 104
Scottsdale, AZ 85260
1.6 Administration
CompactPCI is an open specification supported by the PCI Industrial Manufacturers
Group (PICMG). PICMG maintains this specification and is chartered to:
• Extend the PCI standard into industrial systems
• Manage and maintan relevant PCI specifications
• Contribute to the establishment of relevant PCI specifications as an industry
wide specification
For information on how to become a PICMG member, please contact:
PICMG
401 Edgewater Place
Suite 500
Wakefield, MA 01880 USA
Tel: 781.224.1100
Fax: 781.224.1239
Web: http://www.picmg.org
1.7 Name And Logo Usage
The PCI Industrial Computer Manufacturers Group’s policy regard!ng the use of the
trademarks, PICMG, CompactPCI, and Voe PICMG, CompactPCI logos is as fol-
lows:
• Any company may claim compatibility with PICMG, whether a member of the
PICMG or not.
• Permission to use the PICMG and CompactPCI logo is automatical I у granted to
designated members only as stipulated on the most recent Membership Privileges
document, during the period of time for which their membership dues are paid.
• Member’s distributors and sales representatives may use the PICMG and Com-
pactPCI logo i n promoti ng member’s products sold under the name of the mem-
ber.
• The PICMG and CompactPCI logos shall be printed in black or in color as illus-
trated on the Logo Page that i s aval I abl e f rom the PI CM G at the address above.
The center bar of the logo contani ng the phrase “PICMG” or “CompactPCI” is
set hori zontal I у and the aspect rati о of the I ogo shall be mai ntai ned, but the si ze
may be varied. Nothing may be added to or deleted from the PICMG and Com-
pactPCI logos.
• Si nee the PICMG and CompactPCI logos, and the PICMG and CompactPCI
names are trademarks of the PICMG, the fol lowing statement shall be included in
all published literature and advertising materia! in which the logo appears:
PICMG®, CompactPCr and the PICMG®, CompactPCI® logos are registered
trademarks of the PCI Industrial Computers Manufacturers Group.
2 Electrical Requirements
2.1 Power Supply Design Rules
CompactPCI pluggable power supplies that conform to this specification shall conform to the
following electrical requirements:
a) shall provide all required outputs, per PICMG 2.0 core specification,
b) shall support the power connector pinout described in Table 9 (which includes information
on required vs. optional signals),
c) shall meet the vol tage tol erance and ri ppi e requi rements of PI CM G 2.0 when connected to a
backplane meeting the capacitance recommended in PICMG 2.0 for atwo slot configuration
(twicethe recommended single slot capacitance),
d) may use two power connectors (P1 and P2) for higher output power supplies. The pinouts
of these two connectors shall be identical with the exception of signal pins. If two
connectors are provided, signal pi ns shall be provided on the upper connector (P2), and
may be provided on the lower connector (P1). Refer to Table 9 for specific signal pin
requirements. If only one connector is provided, the upper connector (P2) shall be
installed,
e) Connector power pi ns may be depopulated for lower current applications, and signal pins
may be depopulated for lower connectors (P1). Refer to Table 10 for power pin
depopulation,
f) The EN# and INH# signals, if used, shall source< 150 uA intoagrounded input, and shall
source<+15V into an open circuit input,
g) The signals GA[2..O] on the power connector, are avail able for use by power supplies to
provide a unique differentiation based upon which physical slot the board has been inserted
Power supplies that support the system management bus can use these signals to provide a
unique address within the system. Each signal shall be pulled up with a 10.0 К ±10%
resistor on any board using the geographic addressing signals GA[2..O].
2.1.1
Additional Warm Swap Power Supply Design Rules For Hot Swap Systems
In addition to the above requirements, CompactPCI pluggable power supplies that support
CompactPCI hot swap applications shall conform to the following electrical requirements:
a) shall specify the backplane bulk capacitance characteristics that are required to meet the
hot swap voltage transient specifications defined in PICMG 2.1 when subjected to
daughter board hot swap power supply current turn-on transients as defined in PICMG
2.1,
b) shall meet the hot swap voltage transient specifications defined in PICMG 2.1 when one
of two identical redundant power supplies is disabled, removed, inserted, and enabled
under load (warm swap). Note: bulk power supply output storage capacitors shall not
be connected to the connector side of the isolati ng devices on the power supply.
c) shall provide OR-ing diodes, FETs, or similar isolating devices to support fault tolerance
on all outputs, and should provide circuitry to support current sharing,
d) shall provi de a means to enabl e and di sabl e the power suppl у, i n order to support warm
swap in redundant applications; warm swap shall be supported by using the EN# pin to
turn the power supply on and off during removal/insertion. Warm swap power supplies
may also provideafront panel switch to enableand di sable the power supply. Warm
swap power supplies shall also provide circuitry to support warm swap controlled turn-
on and turn-off.
e) shall meet a voltage tolerance of +4%, -2% for V1 and V2 outputs, and +/-4% on +V3
and -V4. These tol erances shall be met over rated mi ni mum to maxi mum rated I oad and
minimum to maximum rated temperature.
I
2.1.2 Design notes:
Note: Thefollowing information isfor reference only, and may not represent current safety
requirements. Refer to the governing safety standard (e.g. UL1950 or EN60950) for
current safety requirements.
> 3.2 mm min. distance required between the PCB pads of ACL/ACN and GND as well
as any fastening hardware.
> 6.4 mm min. distance required between the PCB pads of ACL/ACN and signal/output
pads.
> 2.5 mm min. distance required between ACL and ACN but should provide largest
practical spacing.
2.2 Backplane/Platform Design Rules
CompactPCI backplanes^platforms supporting pluggable power supplies that conform to this
specification shall conform to thefollowing electrical requirements:
a) shall support thefollowing control signal sat the system slot:
FAL# (Slot 1, J2:C15)
DEG# (Slot 1, J2:C16)
Backplanes provi di ng a modular power supply connector shall logically connect these
si gnal s f rom the power suppl у to the appropri ate si gnal pi ns on the system si ot. Thi s may
be either via a direct wiring connection, or via a logical gating/combining of the outputs of
morethan one power supply. Thislogical gating/combining of the outputs of more than
one power supply may be accompli shed via a separate monitor circuit,
b) shall support thefollowing control signals at the power supply slot:
EN# (shall be either grounded permanently on the backplane or controlled by an enabling
switch or circuit). For high availability applications, the EN# control pi ns should be
grounded permanently on the backplane for all power supplies,
INH# (shall be either aNO CONNECT on the backplane or controlled by an enabling
switch or circuit),
c) may use two power connectors (J1 and J2) for higher output power supplies. The pinouts
of these two connectors shall be identical with the exception of signal pins. If two
connectors are provided, signal pi ns shall be provided on the upper connector (J2), and
may be provided on the lower connector (J1). Refer toTable9 for specific signal pin
requirements. If only one connector is provided, the upper connector (J2) shall deinstalled,
d) connector signal pi ns may be depopulated for lower connectors (J1). All connector power
pi ns shall depopulated,
e) The EN# and INH# signals shall be capable of sinking > 2 mA at < 0.5V, and shall have a
breakdown rating of >= +15V into an open circuit input,
f) TheGAO, GA1, and GA2 signals shall be supported by the backplane per Table 1
Tabic 1 Power Supply Geographic Addressing
Power Supply Slot Number GA2 GAI GAO
i 1 GND GND GND
2 GND GND Open
0 r 5 з GND Open GND
X. $ 4 GND Open Open
5 Open GND GND
1 1 6 Open GND Open
1 7 Open Open GND
8 Open Open Open
2.2.1 Design notes:
Note: Thefollowing information isfor reference only, and may not represent current safety
requirements. Refer to the governing safety standard (e.g. UL1950 or EN60950) for
current safety requirements.
> 3.2 mm min. distance required between the PCB pads of ACL/ACN and GND as well
as any fastening hardware.
> 6.4 mm min. distance required between the PCB pads of ACL/ACN and signal/output
> 2.5 mm min. distance required between ACL and ACN but should provide largest
practical spacing.
3 Mechanical Requirements
3.1 Board Requirements
CompactPCI pluggable power supplies that conform to this specification shall conform to the
fol I owi ng mechani cal requi rements:
a) shall meet mechanical envelope dimensions as depicted in Figure 1 and Figure2 for an
8HP width power supply. For other widths, these dimensions shall be scaled appropriately,
b) shall meet the connector location dimensions as depicted in Figures and Figure 4
This is accomplished by using VITA 30- 199x (draft) compatible 1/2 HP offset guide rails
for pluggable power supplies. Note that this means that the card guide’s slot and
injector/qector PCB mounting surface are shifted 2.54 mm (0.1 in.) to the right.
c) power supplies should be 4HP width, or any multi pie thereof; power supplies may beany
other wi dth that i s greater than 4H P and i s a mul ti pl e of 1H P, but thi s i s not recommended
because it may cause packaging integration problems,
d) power supply chassis, shields, heat sinks and components shall not violate the maximum
envelope, as depicted in Figure 2 for an 8HP width power supply. For other widths, these
? dimensions shall be scaled appropriately,
e) shall provide IEEE 1101.10 compatible front panel with EMI gasket and guide pin,
f) should provide IEEE 1101.11 compatible front panel protective ground,
g) 3U power suppl i es should provi de an I EEE 1101.10 compati bl e i nj ector/extractor devi ce,
located on the lower edge of the board’s front panel,
h) 6U power supplies should provide two IEEE 1101.10 compati bl einj ector/extractor devices,
i) shall providelEEE 1101.10 compatible front panel keying; and the I EEE 1101.10
compatible front panel keying shall beset to the key codespecified inTable2 ,Table3
Table 4 , and Table 5 according to the configuration of the power supply.
j) Power supply manufacturers should define their specific requirements such as maximum
operating temperature and cooling, including required cooling airflow rate, and any
restri cti ons on ai r f I ow di recti on. Thi s cool i ng ai r f I ow rate i s the ai r f I ow requi red to cool
the power supply at maximum rated output power and maximum rated temperature, when
tested within the power supply’s mechanical envelope (e.g. 4HP, 8HP width of power
supply), and should provi de data on the resulting pressure drop at that required air flow
rate.
Power supply keying options have been registered with PICMG. Sincethereisno possibility of
mating problems with 2mm connectors, these key optionswill beindependent of the 2mm
application card keys.
k) Although Figures 1 through 4 depict aprinted circuit board type of power supply, the
power supply may be implemented in adifferent way as long as the mechanical dimensions
conform to this specification.
3. 1.1 Additional Warm Swap Power Supply Design Rules For Hot Swap Systems
In addition to the above requirements, CompactPCI power supplies that support
CompactPCI hot swap applications shall conform to the fol I owing mechanical requirements:
a) shall provide a bottom card edge ESD discharge strip that conforms to the PICMG 2.1
Hot Swap specification.
Figure 1
Cross Sectional Board, Connector, Backplane and Front Panel View.
5.
2
KXSEBSt
1
t>A* lob илуъ
RONT PANEL
FRONT VIEW
PCB
COMPONENT
NOTE 1
COMPONENT
SIDE 2
1 AND IEEE 1101.10 FOR
6.61
(WHICH MAY INCLUDE COOLING FINS) SEE
IEEE 1101 1 FOR DETAILS
-----31 49—
MAX HEIGHT
SEE NOTE 2
---------8HP
(INTERBOARD SEPARATION);
PLANE I
COVERS. SEE IEEE 1101
DETAILS
2 THE 31 49 MAXIMUM
OF COMPONENT HEIGHT
NOTES:
I THE 6 5 MAXIMUM DIMENSION IS INCLUSIVE
OF LEAD LENGTH/COMPONENT HEIGHT AND PROTECTIVE
(--COMPONENT SIDE 1
I
6.5 MAX HEIGHT
See Note
Component
LEA
NOTE 1
POWER SUPPLY
dimension is inclusive
AND PROTECTIVE COVERS
4
3
NOHC
COMPONENT
OUTLINE
Figure 2 Component Outline.
Figure 3 3U Board Connector Location Dimensions.
Figure 4 6U Board Connector Location Dimensions.
3.1.2 Front Panel Keying
Refer to IEEE1101.10 for information on key locations Use of front panel key chambers D,
E, and F aredefined here for both 3U and 6U pluggable power supply slot locations only.
Front panel key chambers A, B, and C are al so def i ned here for 6U power suppl i es, and are set
identically to key chambers D, E, and F. Chambers A, B, and C are keyed on 6U power
suppl i es i n order to provi de keys phy si cal I у cl ose to both Р1 /J1 and P2/J2. S nee power
supplies are using a diff erent type of connector vs other CompactPCI slots, there is no
possibility of mating problems with 2mm connectors These key optionswill beindependent
of the 2mm application card keys, and may duplicate key codes that are used for different
purposes el sewhere i n the system. Thi s i s acceptabl e, and wi 11 cause no probl ems
Tabic 2 Chamber D, E, and A, В Key Codes for AC Input Power Supplies
Key Combination for Input Power
Key Chamber 1) (Also Chamber A for 6U power supplies) Key Chamber E (Also Chamber В for 6U power supplies)
Input Power Type Key Chamber I) (&A) Position Input Power Configuration Key Chamber E (&B) Position
AC Input 1 Universal AC input range (Note: Set key on enclosure as appropri ate to the I i ne vol tage i n use; see below) Empty (power supply only)
110VAC range (85VAC to 132V AC) 1
220VAC range (170VAC to 264VAC) 2
Reserved 3
Reserved 4
Table 3 Chamber D, E, and A, В Key Codes for DC Input Power Supplies
Key Combination for Input Power
Key Chamber D (Also Chamber A for 6U power supplies) Key Chamber E (Also Chamber В for 6U power supplies)
Input Power Type Key Chamber D (&A) Position Input Power Configuration Key Chamber E (&B) Position
DC Input 3 Reserved 1 Reserved 2 -36VDCto-72VDC 3 +18VDC to+36VDC 4
Table 4 Reserved Chamber D and A Kev Codes
•>
Key Chamber D
(Also Chamber A for 6U power supplies)
2
4
Empty
Table 5 Chamber F and C Key Codes for Output Power
Key Chamber F (Also Chamber C for 6U power supplies)
Output Power Configuration Key Chamber F (&C) Position
V1 =5V V2 = 3.3V V3 = +12V V4 = -12V 1
Reserved 2
Reserved 3
Reserved 4
3.2 Backplane/Platform Requirements
CompactPCI backplanes^platforms supporting pluggable power supplies that conform to this
specification shall conform to thefollowing mechanical requirements:
a) shall meet thebackplane'platform connector location di mens ons as depicted in Figure5
andHgureO .
Thisshall be accompli shed by using VITA 30 - 199x (draft) compatible 1/2 HPoffset guide
rails for pluggable power supplies. Color shall be green. Note that thismeansthat the slot in
the card guide and injector/ejector PCB mounting surface are shifted 2.54 mm (0.1 in.) to the
right with respect to thefront panel keying and alignment pin.
b) should provide IEEE 1101.11 compatible front panel protective ground.
c) shall provide IEEE1101.10 compatible front panel keying; and the IEEE1101.10
compatible front panel keying shall beset to thekey codespecified in Table2 ,Table3 ,
Table4 , andTable5 according to the configuration of the power supply that is supported
by the platform.
3. 2.1 Additional Warm Swap Power Supply Design Rules For Hot Swap Systems
I n addition to the above requi rements, CompactPCI enclosures^platforms that support
CompactPCI hot swap applications shall conform to thefollowing mechanical requirements:
b) shall provide at least one IEEE1101.10 compatible card guide ESD clip for each
pluggable power supply. The card guide ESD cl ip shall conform to the PICMG 2.1 Hot
Swap specification.
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FIRST INTERBOARD
SEPARATION PLANE
CONNECTOR SIDE
(FRONT OF BACKPLANE
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3U BACKPLANE
W/P0WER CONNECTOR
Figure 5 3U Backplane Dimensions with Power Connector.
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SEPARATION PLANE
LAST INTERBOARD
SEPARATION PLANE
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Figure 6 6U Backplane Dimensions with Power Connector.
4 Safety Agency Issues
Products shall be designed to meet the relevant portions of international safety standards UL1950
and EN60950.
Information on additional agency requirements that may be relevant in some applications is included
in Appendix C.
I 1 кПЛ
5 Connector Implementation
5.1 Introduction
j
Appendix D of this specification defines a power connector solution for pluggable power supply
applications in subracks based on IEEE 1101.1, IEEE 1101.10, and VITA 30, and it is
recommended for use in all new CompactPCI applications of this type.
Lower power requirements may be met by utilizing a lower cost depopulated version of the
connector, as defined in this specification. Theselow current requirements may also be met by
utilizing theTypeM DIN connector and pinout as defined in Appendix A.
There is an existing practice utilizing a38 position connector that is physically similar to the47
pin PICMG 2.11 power connector. Warning: Various mechanical implementations have
been used for this 38 position connector existing practice. Users should ensure mechanical
compatibility between power suppliesand systems Information about thisexisting practiceis
included in Appendix B.
The power connector philosophy is as follows:
> Keep the existing DIN typeM connector as an existing practice.
> Use the new connector that addresses a broader set of requi rements.
> As technology evolves, the connector options can grow.
> Use the same connector and pin configuration for 3U and 6U power supplies
> System voltage requirementswill continue to evolve downward with 2.5 V seen as the next
step. Therefore, the new Power Interface specification allows a mechanism to support
different system voltage combi nations The four main power supply output voltage
designations have been changed to V1 through V4, generically. Key codes have been
reserved in order to support this future migration.
)
5.2 Connector Guidelines
The power connector type identified in this specification was designed to meet thefollowing:
> Shall support both 3U and 6U power supply configurations,
> Shall provideremotesensecapability,
> Shall support for Hot Swap utilizing a “warn swap” model,
> Shall provide support for current shari ng,
> Should support serial communication with power supplies in high availability systems.
The connector pi n assignment was designed to meet the fol lowi ng goals:
> Shall meet international safety regulations per UL1950 and EN60950.
> Shall minimize EMI loop size by locating return pins near the primary output pinsand
locating high and low sense pins near each other.
> Shall physically separate the power inputs from the outputs for improved noise reduction.
5.3 Connector Requirements
The power connector type identified in this specification was designed to:
> Connector thickness shall support single-slot width power supplies. This means that
maximum connector height off the board will be 12.7 mm (0.5 in.).
> M axi mum connector I ength shall be I ess than or equal to 94.0 mm (3.70 i n.).
> Insertion/extraction force shall be < 100 Newtons per connector.
> I nput power pi ns on backpl ane si de should have shrouded, I atchi ng rear-si de connector
option and/or pass-through crimp termination option.
> Should support solder pins on power supply connector, solder and press-fit pin options on
the backplane connector.
> Should support panel mount and crimp pin optionsfor thebackplaneconnector.
> Shall provide retention during soldering on power supply connector.
> Shall provide 250 cycles life per I EC 60512-5 test 9a
> The connector shall haveallL 94 V-Of lammability rating.
> Shall be capable of blind mating with a+/-1 mm and 2° misalignment in longitudinal and
transverse axes.
> The connector shall have sequential pin mating as fol lows:
CGND mates first, breaks last.
ENA# mates last, breaksfirst.
All other pins mate second, break second.
A minimum of 1 mm sequencing step sze under nominal conditions
> Connector current carrying capabiIity shall be determined based on 30<С temperature rise
when tested in accordance with CSA C22.2 No 182.3-M1987
> Should support I ess than 15 mV voltage drop across mated contact at required current at
70°C internal ambient.
> Shall meet UL 1950 and EN60950 pin test and probe test. These are defined in UL 1950,
paragraph 2.1.2 and EN60950, paragraph 2.1.2..
5.3.1 Power Connector Environmental Requirements
The Power Connector Envi ronmental requi rements are as fol lows:
> Temperature range:
> Humidity:
> Voltage proof:
> Voltage proof:
> Voltage proof:
> Vibration:
> Shock:
AC contacts:
DC contacts:
Signal contacts:
-554310+12543
95 % R. H. at 4043
3000 volts r.m.s
1500 volts r.m.s
1000 volts r.m.s
10 Hz to 2000 Hz, 1.5 mm, 20G
490 m/s?, 11 ms
For further connector information, refer to Appendix D.
5.3.2 Power Connector Pin Requirements
Current
Pin Name Rating
CGND 23A
ACL/-DCIN 23A
ACN/+DC IN 23A
V1 64A
V2 96 A
RTN 128 A
V3 16A
RTN 16A
V4 2A
RTN 2A
RTN 2A
V1 SENSE <1A
V2 SENSE <1A
V3 SENSE <1A
SENSE RTN <1A
V1SHARE <1A
V2SHARE <1A
V3SHARE <1A
EN# <1A
INH# <1A
FAIL# <1A
DEG# <1A
IPMB.SCL <1A
IPMB_SDA <1A
IPMB_PWR <1A
RESERVED <1A
V2ADJ <1A
V1ADJ <1A
GAO <1A
GA1 <1A
GA2 <1A
Description
Chassis ground (safety ground)
AC line input or DCV input
AC neutral input or DCV RTN
V 1 output
V 2 output
V1&V2 Return2
V 3 output
V 3 Return1
V 4 output
V 4 Return1
Signal Return1
V 1 remote sense
V 2 remote sense
V 3 remote sense
Remote sense return
V 1 current share
V 2 current share
V3 current share
Enable
Inhibit
Fail
Degrade
Reserved for future System Management Bus
Reserved for future System Management Bus
Reserved for future System Management Bus
No connect
Voltage adjust input for V
Voltage adjust input for V
Geographic Address 0
Geographic Address 1
Geographi c Address 2
2 All returns are common. They are listed separately in order to clearly identify where the currents are coming from.
A brief description of the modular power connector signals is as fol lows:
EN# Enable signal should be used to “turn on” the power supply outputs. EN# is used in
conjunction with INH# (seeTable6 ) and is typical I у connected to ground to
enabl e the power suppl у after other si gnal s on I onger pi ns have made contact. Thi s
signal is optional. Refer to seetion 2.1.1 of this specification for additional hot
swap requirements.
INH# Inhibit signal should be used to “turn off” the power supply outputs. This signal is
on a longer pi n than the EN# (enable) signal and therefore has precedence over the
EN# s’gnal when determining power supply operation ( see Table 6 ). The INH#
signal i s typical I у connected to an “ON/OFF switch.
Table 6 Modular Power Operation.
INH# = Low Low Open Open
EN# = Low Open Low Open
Power Status “OFF “OFF “ON” “OFF
VI SHARE V1 (typically 5V) Current Share signal may be used between multiple power
suppl i es f or I oad bal anci ng. Thi s si gnal i s not requi red for si ngl e power suppl у
systems
V2 SHARE V2 (typically 3.3V) Current Share signal may be used between multiple
power supplies for load balancing. This signal is not required for single power supply
'j systems
V3 SHARE V3 (typically +12V) Current Share signal may be used between multiple
power suppl i es f or I oad bal anci ng. Thi s si gnal i s not requi red for si ngl e power suppl у
systems
Observation: Because implementation and timing for V1 SHARE, V2 SHARE, and
V3 SHARE may vary from manufacturer to manufacturer, interoperability between
two or more power supplies from different manufacturers is not guaranteed.
SENSE RTN Return Sense shall be connected to the center of the backplane’s ground
plane for accommodating power distribution losses This signal is required for all
modular power supplies
VI VI (typically 5V) shall be connected via a low impedance to the backplane’s power
plane for minimizing power distribution losses This signal is required for all modular
power supplies
V2 V2 (typically 3.3V) shall beconnected viaalow impedance to the backplane’s
power pl ane for mi ni mi zi ng power di st ri but i on I osses Thi s si gnal i s requi red for al I
modular power supplies
V3 V3 (typically +J2V) shall be connected via a low i mpedance to the backplane’s
power plane for minimizing power distribution losses This signal is required for all
modular power supplies
*
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V4 V4 (typically -12V) shall be connected via a low impedance to the backplane’s
power pl ane for mi ni mi zi ng power di str i buti on I osses. Thi s si gnal i s requi red for al I
modular power supplies.
RTN Return shall be connected via a Iow i mpedance to the backpl ane’s ground pl ane for
mini mi zing power distribution losses This signal is required for all modular power
supplies.
V1SENSE VI (typically 5V) Sense shall be connected to the center of the backplane’s
power plane for accommodating power distribution losses. This signal is required for
all modular power supplies
V2SENSE V2 (typically 3.3V) Sense shall be connected to the center of the backplane’s
power plane for accommodating power distribution losses This signal is required for
all modular power supplies
V3SENSE V3 (typically +12V) Sense shall be connected to the center of the backplane’s
power plane for accommodating power distribution losses This signal is required for
all modular power supplies
ACL/-DC IN AC Line/ Negative DC input shall be used as the AC Line voltage input for
supplies operating from AC, or the-DC voltage input for DC input power supplies
Front panel keying is provided to prevent damaging an AC power supply inserted
i nto a backplane wi red for DC and vice versa
ACN/+DC AC Neutral/ Positive DC i nput shall be used as the AC Neutral voltage i nput
for supplies operating from AC, or the +DC voltage input for DC input power
supplies Front panel keying is provided to prevent damaging an AC power supply
inserted into a backpl ane wired for DC and vice versa
CGND Chassis GND signal shall be connected to safety ground with a low impedance
connection.
IPMB_SCL Reserved for System management Bus, based on PICMG 2.9. This signal is
intended for serial communication with the pluggable power supply; it will be defined
in afuture revision of this specification
IPMB_SDA Reserved for System management Bus, based on PICMG 2.9. This signal is
intended for serial communication with the pluggable power supply; it will be defined
in afuture revision of this specification
IPMB-PWR Reserved for System management Bus, based on PICMG 2.9. This signal is
intended for serial communication with the pluggable power supply; it will be defined
in afuture revision of this specification
RESERVED Reserved, No connect. This signal shall be left open.
DEG# Derating signal may be used as an output from the power supply to indicate that the
suppl у i s begi nni ng to derate i ts power output. Thi s si gnal i s opti onal. Note that
backplanes providing a modular power supply connector shall connect DEG# to the
backplanesignal DEG#(P2:C16), either viaadirect wiring connection, or viaa
I ogi cal gati ng/combi ni ng of the outputs of more than one power suppl у, i n the event
that a power suppl у i mpl ementi ng thi s si gnal i s i nstal led. Thi s i s a TTL-compati bl e
open-col I ector/drain active-low signal.
FAL# Supply Fail signal shall be used as an output from the power supply to indicate that
it has failed. Note that backplanes providing a modular power supply connector shall
connect FAL# to the backplane signal FAL#(P2:C15), either viaadirect wiring
connection, or via a logical gating/combining of the outputs of more than one power
supply, in the event that a power supply implementing thissignal is installed. Thisisa
TTL compatible open collector/drain active-low signal.
V1 ADJ V1 output voltage may be margi ned up to +10% if V1A DJ i nput is pul I ed to
RTN or -10% if pulled to V1 using a programming resistor network. Typical usage
isRt=10K . See Figure? . An open circuit on the backplane shall result in a
nominal output voltage.
V2ADJ V2 output voltage may be margined up to +10% if V2ADJ input is pulled to
RTN or -10% if pulled to V2 using a programming resistor network. Typical usage
isRt=10K . See Figure? . An open circuit on the backplane shall result in a
nominal output voltage.
Figure 7 Voltage Adjust
GA[2..O] The physical slot address (GA[2..O]) shall be encoded on the backplane by
grounding and leaving unconnected different combi nations of pi ns at each connector.
Physical slot addresses are defi ned by the physical slot number on the platform per
Table? . Dueto the limited number of power supply geographic addresses available,
physical slot numbersfor power supplies are independent of physical slot numbers
for CompactPCI boards. Power supply physical slot numbers shall start at 0 in the
top-1 eft corner of the card cage. Each si gnal shall be pul I ed up wi th a 10.0 К
±10% resistor on any power supply using the geographic addressing signals
GA[2..O].
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Tabic 7 Physical Slot Addresses
Physical Slot Number GA[2| GA[I] GA[O]
0 GND GND GND
1 GND GND Open
2 GND Open GND
3 GND Open Open
4 Open GND GND
5 Open GND Open
6 Open Open GND
7<1> Open Open Open
Note:
(1) Physical slot number “7’ is reserved for future use.
5.3.2.1 Interoperability
Power supplies manufactured by different vendors may not be compatible and may not operate
Baccordi ng to the guidel i nes publ ished either herd n or by the vendor, when used together. Due to
potential incompatibility in current share signals between different vendors' power supplies, utilizing
a mi x of two vendors' power suppl i es wi th current shari ng i n a si ngl e system i s not recommended.
Power suppl i es shall not cause damage to a di ssi mi I ar power suppl у when used together. Power
suppl i es shall be abl e to wi thstand a vol tage of 15 Vol ts appl i ed to any of the current share pi ns
without damage. Power supplies shall not impose a voltage potential of greater than 15 Volts DC
on any of thefollowing connector pins, listed in Table8 .
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Table 8 Interoperability Signal Requirements.
Pin # Signal Name Descriptio n Requirement Bus s ing
29 VI ADJ VI Adjust Source within ±15 V, Withstand ±15 V Unbussed
32 V2ADJ V2 Adjust Source within ±15V, Withstand ±75 V Unbussed
35 VI SHARE VI Си rre nt Sha re Source within ±15V, Withstand ±15V Bussed
41 V2 SHARE V2 С и rre nt Share Source within ±15V, Withstand ±15 V Bussed
44 V3 SHARE V3 Current Share Source within ±15 V, Withstand ±75V Bussed
5.4 Power Connector Description
At the time of this publication, the power connector did not have an IEC designation.
Detaled specifications for the power connector are located in Appendix D. Upon IEC
approval, this appendix will be superseded by the IEC connector specification.
5.5 Modular Power Supply Connector Pinout
CompactPCI pluggable power supplies shall provide signal routing to the rear backplane 5 connector as listed in Table9
Tabic 9 Power Connector Pin Assignments.
| Rn# <’> Staging #(2) | Signal Name Description |
1-4 M V1 V1 Output
5-12 M RTN V1 and V2 Return
5 13-18 M V2 V2 Output
r 19 M RTN V3 Return
20 M V3 V3 Output
• — 21 M V4 V4 Output
22 M RTN Signal Return
£ 5 23 M RESERVED Reserved
: 24 M RTN V4 Return
25 M GAO Geogr^chic Address Bit 0
26 M RESERVED Reserved
j 27 S EN# Enable
28 M GA1 Geographic Address Bit 1
0 29 M V1ADJ V1 Adjust
b : so M V1 SENSE V1 Remote Sense
31 M GA2 Geographic Address Bit 2
32 M V2ADJ V2 Adjust
33 M V2 SENSE V2 Remote Sense
34 M SRTN Sense Return
1 35 M V1SHARE V1 Current Share
36 M V3 SENSE V3 Remote Sense
Z 37 M IPMB_SCL 3 Reserved for System Management Bus
38 M DEG# Degrades gnal
39 M INH# Inhibit
G 40 M IPMB_SDA 3 Reserved for System Management Bus
41 M V2SHARE V2 Current Share
42 M FAL# Fail Sgnal
43 M IPMB_PWR 3 Reserved for System Management Bus
c 44 M V3SHARE V3 Current Share
C 45 L CGND Chassis Ground (safety ground)
46 M ACN/+DCIN AC Input - Neutral; +DC Input
- 47 M ACL/-DCIN AC Input-Line; -DC Input
(1) Pin numbers illustrated are of the female backpl ane connector
(2) L = Long length pins (First Mate, Last Break), M = medium length pins, S= Short length pins (Last Make, First
Break)
(3) These signals are to be defined by PICMG 2.9 Secondary System Management Bus
CompactPCI Power Interface Specification PICMG 2.11 R1.0 October 1,1999
For lower current applications, the male (power supply side) power connectors may be selectively
I oaded as shown i n Tabi e 10 bel ow. These opti ons detai I power contact posi ti ons whi ch shall be
loaded when choosing one of the three options shown. The female (backplane) connectors shall be
loaded with all power contacts.
Tabic 10 Power Connector Selective Pin Loading
V1 V2 V3 Returns Total Number Power Contacts
Option 1 1,3,4 13,15,16,17 20 5,6,7,8,9,11,12,19 16
Option 2 1,4 13,16 20 5,8,9,12,19 10
Option 3 1 13 20 5,9,19 6
Note: When using two power connectors for higher current applications, the signal contacts of the lower
male(power supply side) connector P1 may be omitted entirely.
ipi I tan 11 in_j
6 Appendices
documentation is contained in thefollowing appendices.
A. DIN Type M Power Connector
In-Rack Power Connections as specified in PICMG 2.0R2.1
In order to support legacy implementations, connectors compliant with I EC 1076 or I EC
□
603-2, with high current pins, may be used to input AC or DC power to the supply and
output the regulated DC voltages. An I EC 603-2 connector and pi n assignment suitable for
providing 30 A at 5 VDC with remote sensing and 12 A at 3.3 VDC without remote sensing
is illustrated in Hgure8 It is not compatible with the47-pin power connector interface
described in this specification and is not recommended for new designs.
This connector is specified because its use was mandatory for in-rack modular power
supplies in a previous revision of the PICMG 2.0 specification, and its use is an existing
practice at the time of adoption of this specification. Other connectors may be used when
the connector and pin assignment specified here do not meet system requirements.
The female connector is located on the backplane and the male is located on the power
8 supply-
Backplanes providing an in-rack modular power connector shall provide connections for the
optional DEG# and FAL# interrupt signals described below.
A brief description of the modular power connector signals illustrated in Figure 8 follows:
INH# Inhibit signa) may be used to “turn off” the power supply outputs. This signa)
i s on a I onger pi n than the EN# (enabl e) si gna) and therefore has precedence
over the EN# signa) when determining power supply operation (seeTable 11
). The INH# signa) is typically connected to an “ON/OFF switch. This signa)
is optional.
Table 11 Modular Power Supply Operation
INH# = Low Low High High
EN# = Low High Low High
Power Status “OFF “OFF “ON” “OFF
ISH Current Share signal may be used between multiple power supplies for load
balancing. This signa) is not required for single power supply systems.
Observation: Because implementation and timing for ISH may vary from
manufacturer to manufacturer, interoperability between two or more power
supplies from different manufacturers is not guaranteed.
UI I I ILOI I ICU UOCUIIIV I—ALO1IICU L> IOLI I kJULI UI I I I UI II UI LCU
5S- 5 V Sense - shall be connected to the center of the backplane’s ground plane
for accommodating power distribution losses. This signa) is required for all
modular power supplies.
5S+ 5 V Sense + shall be connected to the center of the backplane’s power plane
for accommodating power distribution losses. Thissigna) is required for all
modular power supplies.
ACL AC Line input shall be used for supplies operating from AC. This input is not
requi red for DC i nput power suppl i es. Separate AC and DC i nputs are
provided to prevent damaging an AC power supply inserted into a backplane
wired for DC and vice versa
ACN AC Neutral input shall be used for supplies operating from AC. This input is
not required for DC input power supplies.
+DC Positive DC i nput shall be used for supplies operati ng from DC. This i nput is
not required for AC input power supplies. Separate AC and DC inputs are
provided to prevent damaging a DC power supply inserted into a backplane
wi red for AC and vice versa
-DC Negative DC i nput shall be used for supplies operating from DC. This input is
not required for AC input power supplies.
EN# Enable signal may be used to “turn on” the power supply outputs. EN# is used
in conjunction with INH# and is typical ly connected to ground to enablethe
power supply after other signaJson longer pins have made contact. Thissigna)
is optional.
DEG# Derating signal may be used as an output from the power supply to indicate
that the supply isbeginning to derate its power output. Thissigna) isoptiona).
Note that backplanes providing a modular power supply connector shall
connect DEG# to the backplane signa) DEG#(P2:C16) in the event that a
power supply implementing this signal is installed.
FAL# Supply Fail signa) may be used as an output from the power supply to i ndicate
that it hasfailed. Thissigna) isoptiona). Note that backplanes providing a
modular power supply connector shall connect FAL# to the backplane signal
FAL#(P2:C15) in the event that a power suppl у implementing this signa) is
installed.
All other signals given in Figure 8 are required and shall be provided by the modular power
supply.
О й1-! ©
©
©
13 □□□ □□□ □□□ □□□ □□□ □□□ □□□
20 □□□
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@
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Figure 8
Pin #‘n Staging’21 Mnemonic Description
Column A
A13 EL SP Spare
A14 EL INH# Inhibit Signal
A15 EL ISH Current Share Signal
A16 EL 5S- 5 V Sense-
A17 EL 5S+- 5 V Sense+
A18 EL 3.3V +3.3 V DC
A19 EL +12V +12VDC
A 20 EL -12V -12VDC
Column В
B2 SL ACL AC Line
B5 SL ACN AC Neutral
B8 - - No Pin Loaded
B11 EL CG Chassis Ground
B13 SL 3.3V +3.3 V DC
B14 SL 3.3V +3.3 V DC
B15 SL 3.3V +3.3 V DC
B16 SL 3.3V +3.3 V DC
B17 SL 3.3V +3.3 V DC
B18 SL 3.3V +3.3 V DC
B19 SL +12V +12VDC
В 20 SL -12V -12VDC
B22 EL 5V +5VDC
B25 EL GND Ground
B28 EL +DC +DC Input
B31 EL -DC - DC Input
Column C
C13 SL EN# Enable Signal
C14 SL DEG# Derate Signal
C15 SL FAL# Supply Fail Signal
C16 SL 3.3V +3.3 V DC
C17 SL 3.3V +3.3 V DC
C18 SL 3.3V +3.3 V DC
C19 SL +12V +12VDC
C20 SL -12V -12VDC
Notes:
1. Pi n numbers i 11 ustrated are of the f emal e backpl ane connector.
2. EL is an Extra Length pin. SL is a Standard length pin.
Existing Practice for DIN Type M Power Supply Connector
A.2 Backplane Dimensions
Depending on system design requirements, termination networks, etc., the left and right
ends of a backplane can be made longer. Whenever extended, the end di mensions shall be
in increments of 5.08 mm. Thi swill allow for modular construction of backplanesand
subracks. Fi gure 9 i 11 ustrates a 3U backpl ane wi th a power connector.
APVP
ICSCtlPTinH
2.7 DIAMETER
III I ио i
NONE
4
7
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Figure 9
Connector
Location
8 PI
Connector
Location
8 P2
W.O
4)3
L = Numberoj left end extensions )L 1 >
R = Number о/nyhl end exlenstons (R - .
n = Number of slots in ^8)
4.08 +Lx 508 °
U.3
C mnector
Connector
Location
Connect™
Location
I PI
Connector
Location
2-Pl
n X 20.32 + R X 5.08 ,
U3
n I 2 2
<— 211 f>
40 64
их 20.32 - 12.T
vcwwclokcevluq гм e га «
*— /.55
*~ 18 7
39.09
nx 20.32 1.55'
n x 20.32 + 22.2
Connector
Location
Connector
Locatim
API
CONNECTOR
MOUNTING HOLE
2.0 DIAMETER
О
О
CONNECTOR SIDE
(FRONT OE RACKPIANEl
IIRST INTERHOARD
SI PAR WON PLANE
LAST l\TIR HOARD
SEPARATION PLANE
.Ц' BACKPLANL
W/POWER CON VECTOR
Existing Practice: 3U Backplane Dimensions with DIN Type M Power
Connector.
B. Existing Practice for 38 Position In-rack Power Connection
The38-position power supply connector and pinout shown in Figure 10 has been used in existing
3U and 6U CompactPCI systems. The 38-position power supply connector is not compliant with
this specification (PICMG 2.11). It isnot compatible with the47-pin power connector interface
described in this specification and isnot recommended for new designs. It isnot recommended for
new designs as compliance to this specification requires the use of the47-pin power connector.
Note that power supplies using this connector are positioned in the subrack by using the standard
(no offset) guide rail.
Warning: Various mechanical impl ementations have been used for thi sexi sting practice. Users
should ensure mechanical compatibility between power supplies and systems.
z* 31 2! 2‘ 21 1 1 1 1 1 3: 3 D s 7 5 3 1 9 Z" 7 33 30 27 24 21 • 1 ' 1 1 1 ! 1 1 1 38 36 ,35 *32 ,29 26 23 30 .8 .6 .4 .2 .0
Pin 36 CGND makes first.
Pin 25 EN# makes last.
In utilizing this existing practice, contact
the relevant power supply or system
vendor for mating connector information.
PIN NO. SIGNAL NAME
38 LINE
37 NEUTRAL
36 CGND
35 FAIL#
34 +121
33 +3.31
32 +51
31 INN#
30 +I2S
29 DEG#
28 RSVD
27 +3.3 S
26 -SENSE
25 EN#
24 +5S
23 GND
22 GND
21 -12V
20 RSVD
19 RSVD
18 +12V
/7 GND
16 +3.3 V
15 +3.3 V
14 +3.3 V
13 +3.3 V
12 GND
ll GND
10 GND
9 GND
8 GND
7 GND
6 GND
5 GND
4 +5V
3 +5V
2 +5V
1 +5V
Figure 10 Existing Practice for 38 Position Power Connector and Pin Definitions
C. Additional agency requirements
C.1 Power Supply Considerations for NEBS Compliance
CompactPCI power supplies should be NEBS compliant.
NEBS compliant power supplies should be designed in accordance with the requirements of
Bellcore FR-2063 (particularly sub-documents Bellcore SR-3580, GR-63-CORE, GR-1089-
Z CORE).
D
Note: particular areas of concern, include (but are not limited to):
Hre Resistance, Earthquake & Vibration, Airborne Contaminants, Safety, Bonding &
Grounding, Lightning (AC input), Environmental Characteristics (operating
temperatures, humidity, etc.)
C.2 BackplanePlatform Considerations for NEBS Compliance
NEBS compliant Backpl anesPlatforms should be designed in accordance with the
requirements of Bellcore FR-2063 (particularly sub-documents Bellcore SR-3580, GR-63-
CORE, GR-1089-CORE).
Note: particular areas of concern include but are not limited to:
Fire Resistance, Earthquake& Vibration, Airborne Contaminants, Safety, Bonding &
Grounding, Lightning (AC input)
C.3 Safety issues for NEBS Compliance
NEBS compliant products should be designed in accordance with the safety requirements of
BellcoreGR-1089-CORE (part of FR-2063)
C.4 Environmental requirements for NEBS compliance
Power connectors should be capable of meeting NEBS environmental requirements for
temperature, humidity, fire resistance, earthquake, vibration, shock, and airborne
contaminants per Sections 4.1,4.2,4.3,4.4, and 4.5 of Bellcore GR-63-CORE (part of FR-
2063) when system requirements mandate this.
NEBSIevels1,2and3arespecifiedinBellcoreSR-3580(partof FR-2063). Power
connector manufacturers should specify the level that can be achieved when the connector is
installed and tested in an enclosure/ shelf.
Connector manufacturers should offer connectors which are capable of supporting all of the
various NEBS levels per Bellcore SR-3580 (part of FR-2063) when installed and tested on
an enclosure/shelf.
Note: particular areas of concern for power connector NEBS compliance include but are not
limited to:
Fire Resistance, Earthquake & Vibration & Shock, Airborne Contaminants (Pollutant
Gas), Lightning (voltagebreakdown & in-out coupling).
D. PICMG 2.11 47 position connector specification.
The connector specification is appended to this specification as Appendix D. Upon IEC approval,
this appendix will be superseded by the IEC connector specification number.
The specification contained in Appendix D details a two-part printed board connectors hav-
ing 23 size 16 power contacts, and 24 size 22 signal contacts, for mounting on printed
boards and backplanes for use in bus applications which require the sequential mating of
specified contacts.
CONTENTS
Clause Page
1 General Data.................................................................51
1.1 Recommended method of mounting.......................................51
1.2 Ratings and characteristics..........................................51
1.3 Normative references.................................................51
1.4 Marking..............................................................53
1.5 Type designation.....................................................53
1.6 Ordering information.................................................53
2 Technical Information........................................................55
2.1 Definitions..........................................................55
2.1.1 Contacts and terminations........................................55
2.2 Information on application...........................................55
2.2.1 Complete connectors (pairs)......................................55
2.2.2 Fixed board connectors...........................................55
2.2.3 Free board connectors............................................55
2.2.4 Information on contact terminations..............................55
2.3 Contact arrangements.................................................56
2.3.1 Fixed board connectors...........................................56
2.3.2 Free board connectors............................................56
3 Dimensional Information......................................................57
3.1 General..............................................................57
3.2 Isometric view and common features...................................58
3.2.1 Depth dimensions.................................................59
3.3 Engagement (mating) information......................................60
3.3.1 Electrical engagement length.....................................60
3.3.1.1 First contact point ......................................60
3.3.2 Perpendicular to engagement (mating) direction...................61
3.3.3 Inclination......................................................61
3.3.4 Plana rity.......................................................61
3.4 Fixed board connectors...............................................62
3.4.1 Dimensions.......................................................62
3.4.2 Terminations.....................................................63
3.5 Free board connectors................................................64
3.5.1 Dimensions.......................................................64
3.5.2 Terminations.....................................................65
3.6 Mounting information for fixed board connectors......................66
3.6.1 Hole pattern on panels...........................................66
3.7 Mounting information for free board connectors.......................67
Compact PC1K Power Interface Specification PICMG 2.11 R1.0 October 1, 1999
Page 49 of 92
3.7.1 Hole pattern on printed boards.....................................67
3.8 Gauges.................................................................68
3.8.1 Sizing gauges and retention force gauges...........................68
3.8.2 Test pin for probe damage.......................................69
3.8.3 Test gauge for restricted entry....................................70
4 Characteristics................................................................71
4.1 Climatic category......................................................71
4.2 Electrical.............................................................71
4.2.1 Creepage and clearance distances...................................71
4.2.2 Voltage proof......................................................71
4.2.3 Current carrying capacity.......................................72,73
4.2.4 Contact resistance.................................................74
4.2.5 Insulation resistance..............................................75
4.3 Mechanical.............................................................75
4.3.1 Mechanical operation...............................................75
4.3.2 Insertion and withdrawal forces....................................75
4.3.3 Contact retention in insert.....................................75,76
4.3.4 Contact bending strength...........................................76
4.3.5 Static load, transverse............................................11
4.3.6 Vibration (sinusoidal).............................................11
4.3.7 Shock..............................................................11
5 Test Schedule..................................................................78
5.1 General................................................................78
5.1.1 Arrangement for contact resistance measurement.....................79
5.1.2 Arrangement for dynamic stress tests...............................80
5.1.3 Arrangement for testing static load, transverse....................80
5.1.4 Wiring arrangements for voltage proof and insulation resistance tests 81
5.1.5 A rrangement for flammability test.................................81
5.1.6 Planarity of mounted connectors....................................82
5. /. 7 Test printed board for fixed and free board connectors......83
5.2 Test schedule tables...................................................84
5.2.1 Preliminary group P................................................84
5.2.2 Test Group AP - Dynamic / climatic..............................85, 86
5.2.3 Test Group BP - Mechanical endurance............................87, 88
5.2.4 Test Group CP - Moisture...........................................88
5.2.5 Test Group DP - Electrical load....................................89
5.2.6 Test Group EP - Mechanical resistivity.............................90
5.2.7 Test Group EP - Chemical resistivity...............................91
6 Quality Assessment Procedures Under Consideration..............................91
Clause
1. General Data
1.1 Recommended method of mounting
The contact terminations of the free board connectors are provided for 90
degree angle printed board mounting. The contact terminations must be compat-
ible with the printed board plated holes in accordance with IEC 60326-5.
The contacts of the fixed board connectors may be provided with either press-in
terminations or solder terminations. The connector may be fixed to the backplane
by means of self-tapping screws and the retention forces of press-in or solder ter-
minations.
Ratings and characteristics
Voltage proof
Input contacts
DC Output contacts
Signal contacts
3,000 volts r.m.s.
1,500 volts r.m.s.
1,000 volts r.m.s.
Contact current rating of fully charged connectors when tested in accordance with
CSA C22.2 No 182.3-M1987 requirements.
DC Output Power contacts No. 1 -20
Input Power contacts No. 45-47
Contacts No. 21,22,24
Signal contacts
Insulation resistance:
Climatic category:
Printed board thickness:
16 amperes each
23 amperes each
2 amperes each
< 1 amperes each
>1010Q
PL1: 55/125/56
1,6 mm to 3,0 mm Гог free
board connector
3,2 mm to 5,6 mm for fixed
board connector
A.C. input power contacts on fixed board connectors may be provided
with a pass-through crimp-removable contact termination.
The safety feature requirement of U.L. 1950 (paragraph 2.1.2) described
as “pin test” and “finger test” have been incorporated into the female
connector. Contact numbers 46 and 47 are recessed 5 mm below the face
of the female connector.
1.3 Normative reference
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this Draft: Power Interface
Connector Specification. At the time of publication, the editions indicated were
valid. All normative documents are subject to revision, and parties to agreements
based on this proposed Standard are encouraged to investigate the possibility of
applying the most recent editions of the normative documents indicated below.
Members of 1EC and ISO maintain registers of currently valid International
Standards.
TEC 60068-1: 1988, Environmental testing-Part 1: General and guidance.
Amendment 1 (1992).
1EC 60068-2-54: 1988, Environmental testing - Part 2: Tests. Test Ta: Soldering
- Solder ability testing by the wetting balance method.
IEC 60326-3:1991, Printed boards - Part 3: Design and use of printed boards.
1EC 60326-5: 1995, Printed boards - Part 5: Specification for single and double
side printed boards with plated through holes.
TEC 60512-2: T985, Electromechanical components for electronic equipment;
basic testing procedures and measuring methods - Part 2: General examination,
electrical continuity and contact resistance tests, insulation tests and voltage stress
tests. Amendment 1 (1994).
IEC 60512-3: 1976, Electromechanical components for electronic equipment;
basic testing procedures and measuring methods - Part 3: Current-carrying capac-
ity tests.
TEC 60512-4: 1976, Electromechanical components for electronic equipment;
basic testing procedures and measuring methods - Part 4: Dynamic stress tests.
TEC 60512-5: 1992, Electromechanical components for electronic equipment;
basic testing procedures and measuring methods - Part 5: Impact tests (free com-
ponents), static load test (fixed components), endurance tests and overload tests.
IEC 60512-7: 1993, Part 7: Electromechanical components for electronic equip-
ment; basic testing procedures and measuring methods - Mechanical operating
tests and sealing tests.
TEC 60512-8: 1993, Electromechanical components for electronic equipment;
basic testing procedures and measuring methods - Part 8: Connector tests
(mechanical) and mechanical tests on contacts and terminations.
IEC 60512-9: 1992, Electromechanical components for electronic equipment;
basic testing procedures and measuring methods - Part 9: Miscellaneous tests.
TEC 61076-1: 1995, Generic Specification: Connectors with assessed quality, for
use in d.c. and low frequency analogue applications and in digital applications
employing high speed data rates.
TEC 61076-3 Connectors with assessed quality, for use in d.c., low frequency
analogue and digital high speed data applications. Part 3: Rectangular connectors.
Proposed.
TEC 61076-4: 1995, Sectional Specification: Connectors with assessed quality, for
use in d.c. and low frequency analogue applications and in digital applications
employing high speed data rates, for use with printed boards.
TEC Guide 109: 1995, Environmental aspects - Inclusion in electrotechnical prod-
uct standards.
ISO 468: 1982, Surface roughness. Parameters, their values and general rules for
specifying requirements.
1.4
1.5
1.6
TEC 60807-7: 1991 Rectangular connectors for frequencies below 3 MTTZ, Part
7: Detail specification for a range of connectors with polarized guides on
jackscrews size 16 round contacts. Removable crimp contact types with closed
barrels, rear insertion, front release with assessed quality.
TEC 60352-2 Solderlcss connections - Part 2: Solderless crimped con-
nections. General requirements, test methods and practical guidance.
TEC 60352-3 Solderlcss connections - Part 3: Solderlcss accessible insulation
displacement connections. General requirements, test methods and practical guid-
ance.
TEC 60352-5 Solderless connections - Part 5: Press-in connections.
General requirements, test methods and practical guidance (Second edition).
Marking
Marking of the connector and the associated package may be in accordance
with the requirements specified in 2.6 of IEC 61076-1, or by agreement
between manufacturer and user.
Type designation
Connectors, connector bodies and contacts to which this Power Interface
Connector Specification applies, shall be designated by the following system.
Sec page 52 for system specifications.
Examples: Type designations of connectors described in this detail
specification arc listed below:
Free board connector type designation
61076-4-XXX-A-047M-S4-1В
Fixed board connector type designations
61076-4-XXX-A-047F-S3-1В
61076-4-XXX-A-047F-P1 -1В
61076-4-XXX-A-047F-P2-1В
61076-4-XXX-A-047F-S3C-1В
61076-4-XXX-A-047F-P1 С-1В
61076-4-ХХХ-A-047F-P2C-1В
Ordering information
For ordering connectors according to this detail specification, use type designa-
tion described in clause 1.5 or a manufacturer’s part number which specifies a con-
nector equivalent in all respects to the connector specified in this detail specifica-
tion.
61076-4-XXX L N N N L L
N L
Number of Detail
Specification
Letter denoting the assessment lex el
В Assessment level В
Style Of Connector
23 power contacts 24 signal contacts A
Number of contacts 047
Number denoting the performance level
1 Performance level PL1
I citer denoting gender Free board male connector V
of contact Fixed board female connector F
Letter denoting the type of termination or combination of terminations Solder straight S3 Printed board termination for board thickness of 3.2 mm to 5,6 mm
Solder angled S4 Right angle solder termination for board thickness of 1,6 mm to 3,0 mm
Soldcrlcss solid metal press-in Pl Straight soldcrlcss press-in connection for printed board thickness of 3,2 mm to 5,6 mm
Soldcrlcss compliant press- in P2 Straight soldcrlcss compliant press-in connec- tion for printed board thickness of 3.2 mm to 5,6 mm
Crimp removable contact and solder straight S3C Printed board tennination for board thickness of 3,2 mm to 5,6 mm with AC pass-through crimp removable contacts. Wire size 4 mn? max. Crimp remov- able contacts must be ordered separately.
Crimp removable contact and soldcrlcss solid metal press-in PIC Straight soldcrlcss press-in connection for printed board thickness of 3.2 mm to 5,6 mm with AC pass-through crimp removable con- tacts. Wire size 4 mm2 max. Crimp removable contacts must be ordered separately.
Crimp removable contact and soldcrlcss compliant press-in P2C Straight soldcrlcss compliant press-in connec- tion for printed board thickness of 3,2 mm to 5,6 mm with AC pass-through crimp remov- able contacts. Wire size 4 mm2 max. Crimp removable contacts must be ordered separate- ly-
2. Technical information
2.1 Definitions
2.1.1 Contacts and terminations Program of contact engagement sequencing The connectors shall have sequential contact engagement as follows: Chassis GND contact first to make, last to break FMLB ENA contact last to make, first to break LMFB All other contacts second to make, second to break SMSB
2.2 Information on application
2.2.1 Complete connectors (pairs)
2.2.2 Fixed board connectors Planarity before press-in operation into backplane per clause 3.3.4 and after press-in into backplane per clause 5.1.6
2.2.3 Free board connectors Planarity before soldering into printed board per clause 3.3.4 and after soldering into printed board per clause 5.1.6
2.2.4 Information on contact terminations Sec clauses 3.4.2 and 3.5.2 for contact terminations.
2.3 Contact arrangements
2.3.1 Fixed board connectors
i
IX Size 16 AC Line/ DC Input
View from mating face
Figure 1
2.3.2 Free board connectors
IX Size 16 (01,6mm) Ground
IX Size 16
(01,6mm)
AC' Neutral/
IX Size 16
20X Size 16 (01,6mm)
DC Output Contact
AC Line/ DC
Input
24X Size 22 (00.76mm)
Signal Contact
22T 25l 3Ст 3C 3LL 40T
OO 0 O0 о oo
+> ъъЪЪЪЪЪ ь
View from mating face
Figure 2
Dimensional information
General
All dimensions in millimeters.
Drawings are shown in the first angle projection. The shape of the connectors
may deviate from those given in the following figures as long as the specified
dimensions are not influenced.
The information about the bending per clause 3.4 and per clause 3.5 is valid for
the condition of delivery. The permissible bending of the mounted connector is
stated per clause 5.1.6.
Dimensions not shown may be chosen according to common characteristics and
intended use.
3.2
Isometric view and common features
Reference I .etter Dimensions mm Legend
Cl 94.0 Maximum length of the fixed board connector
M 37,0 31,9 Range of electrical engagement NOTE: For information only - sec clause 3.2.1
XI (Optional) 88 Distance between the two mounting holes of the fixed board connector
X2 (Optional) 85 Distance between the two mounting holes of the free board connector
a (Optional) 6.4 Distance between mounting hole and a line through the center of termi- nation No. 1 of the fixed board connector
d 6.27 Distance between the datum center line and connector side of the print- ed board
g (Optional) 4,9 Distance between the mounting hole and the center of the hole for ter- mination No. 1 of the free board connector
u 34,1 31.9 Range in which reliable contact is ensured Note - See clause 3.2.1 for mating information
3.2.1
Depth dimensions
Contact No. 1
Figure 4 - Depth dimensions
Reference Letter Dimensions mm Legend
M 31,9-37,0 31,9-34 9 31,9-40,6 Range of electrical engagement: For all contacts except those listed below For contact No. 27 For contact No. 45
d 6,27 Distance between the datum center line and connector side of the printed board
u 31,9-34,1 31,9-33,5 31,9-37,2 Range in which reliable contact is ensured: For all contacts except those listed below For contact No. 27 For contact No. 45
3.3
Engagement (mating) information
3.3.1
Electrical engagement length
Contact No. 1 (Datum Point)
Contact No. I (Datum Point)
Of The Free Board Connector
Of The Free Board Connector
37,0 For All Contacts
Except
34,9 For Contact No. 27
And
40.6 For Contact No. 45
Figure 5 - Electrical engagement length
First contact point
17,7 Max. For All Contacts
16,5 Max. For Contact 45,
13,5 Max. For Contacts 46 And
47, And 18,8 Max. For Contacts
21 Through 44
14,5 Min. For All Contacts
13,3 Min. For Contact 45,
10,3 Min. For Contacts 46 And
47, And 17,1 Min. For Contacts
21 Through 44 Reliable Contact
Point
Figure 6 - First contact point
3.3.2
Perpendicular to engagement (mating) direction
The design of the free and fixed board connector must accept a misalignment of
at least 1,5 mm in the transversal and longitudinal direction of the connectors.
To achieve necessary alignment of both parts, one part of the connector pair is
float mounted.
For fixed mounted connector pairs, the mounting tolerances and engagement
shall be kept accordingly in a sufficient small range.
Figure 7 - Perpendicular to engagement (mating) direction
3.3.3 Inclination
The design of the free and fixed board connector must accept an initial angular
misalignment of ± 2° in longitudinal and ± 2° transverse axis.
In the mated position the condition per clause 3.3.1 must be met.
Figure 8 - Inclination
3.3.4 Planaritv
Permissible warpage of mounted connectors is shown in clause 5.1.6.
In order to guarantee the function of the First to Make, Last to Break (FMLB)
ground contact and the Last to Make, First to Break (LMFB) enabling contact
(ENA), the warpage of the mounted connectors must not exceed 0,5 mm.
Fixed board connectors
Dimensions
м
и и и шпшииииииииии
Figure 9 - Fixed board connector
Reference Letter Dimensions mm
A 94,0 Max
В 12,7 Max
Q 80 2 - 79,9
D 9,1 - 8,7
E(Optional) 88.1 - 87,9
E 12.8- 12.6
G 6.1 - 5,9
Reference Letter Dimensions mm
L 1,1 -0.9
M 0 6 - 0,4
N 2.0- 1,9
P 1,3 - 1,0
R (Optional) 6,4
S 4,2
Reference Letter Dimensions mm
T 41,7
V 2,7
W 65.2
X 70.3
Y 75.3
a 2,1
b 2,7
Reference Letter Dimensions mm
c 15.2 for contacts 1 through 20 17,6 tor contacts 21 through 44 14.0 for contact 45 11.0 tor contacts 46 and 47
0d (Optional) 2,6 - 2,5
Table 3
3.4.2
Terminations
Style and dimensions of terminations to be determined by agreement between connector
manufacturer and user.
Printed Board
Figure 10 - Contact terminations and printed board
Letter denoting the type of terminations Solder straight S3
Solderless solid metal press-in Pl
Solderless compliant press-in P2
Crimp removable contact. Added option for S3. Pl and P2 terminations
Table 4
Crimp contact information
Closed barrel, size 16 crimp removable contacts may be used for AC power pass-
through backplane applications. These contacts are described in detail along with
technical data, performance requirements, and test procedures in IEC Standard
60807-7, First Edition 1991. Rectangular connectors for frequencies below 3 MHZ,
Part 7: Detail specification for a range of connectors with polarized guides on
jackscrews size 16 round contacts. Removable crimp contact types with closed
barrels, rear insertion, front release with assessed quality.
Closed barrel size 16 crimp removable contacts having a rear insertion, rear release fea-
ture may be used by agreement between connector manufacturer and user.
3.5 Free board connectors
Dimensions
Figure 11 - Free board connector dimensions
Reference Letter Dimensions mm
A 91,2 Max
В 12,7 Max
C 80.7 - 80,3
D 9.6 - 9,2
E (Optional) 85.1 - 84,9
F 17,6- 17,4
G 7,9 - 7,4
H 11,7 Max.
О J 1,6
0 К 0.76
Reference Letter Dimensions mm
L 1.1 -0.9
M 1.2-0.9
N 2.0 - 1.9
P 1.2 -0.8
R (Optional) 4.9
S 4,2
T 41.7
V 2.7
Reference Letter Dimensions mm
W 65,2
X 70.3
Y 75.3
a 2,1
b 2,7
c 7.5 for contacts 1 through 20 5,9 for contacts 21 through 26 and 28 through 44 3,8 for contact 27 11,8 for contacts 45 through 47
Reference Letter Dimensions nun
Od (Optional) 2,6 - 2.5
c (Optional) 3,9 - 3,7
f 4,7 - 3,7
g 4.6 - 3.9
h 4,1 -3.1
к 3,1 - 2,3
m 84,0 - 83,6
n 4,8 - 4,6
3.5.2 Terminations
Style and dimensions of terminations to be determined by agreement between
connector manufacturer and user.
Printed Board
Figure 12 - Contact terminations and printed board
Letter denoting the type of termination Solder angled S4
Table 6
6. Appendix D
3.6 Mounting information for fixed board connectors
Hole pattern on panels
Drawings:
View on connector side of printed board
Center Line
Datum Plane
I—16X 2,70
2X 03,05
Optional
Non
Vletalizcd
Holes
23X 2,13
41,70
65,20
75,30
88,00 -Optional
Plated through holes shall be provided in aeeordanee with IEC 60326-5
Optional
Figure 13 - Hole pattern on panels
Contact No. 1
Datum Plane
Termination type hemale contacts only Printed board hole diameters to be determined by agreement between connector manufacturer and user.
Straight solder printed board mount S3 terminations only
Straight solderlcss press in, compliant or solid Pl or P2 termination types only
Straight solder printed board mount S3C termination types, with size 16 AC pass-through power crimp re-movable contacts
Straight solderlcss press in compliant or solid PIC or P2C termination types with size 16 AC pass through power crimp removable contacts
3.7
3.7.1
Mounting information for free board connectors
Hole pattern
Drawings: View on connector side of printed board
Plated through holes shall be provided in accordance with IEC 60326-5
Figure 14 - Hole pattern on printed boards
Right Angle Printed Board Mount Connector
Termination type Printed board hole diameters to be determined by agreement between connector manufacturer and user.
Right angle solder printed board mount
Table 8
3.8
3.8.1
Gauges
Sizing gauges and retention force gauges
Material: tool steel, hardened
Surface Roughness: according to ISO Standard 468
Ra = 0,15 pm to 0,25 pm
SIZING GAUGE
Pll
RETENTION FORCE GAUGE
P12
Figure 15
Contact Size Sizing Gauge Retention Force Gauge
Maximum GA Minimum 0A Maximum 0A Minimum 0A Mass
16 1,613 mm 1,608 mm 1,567 mm 1,562 mm 56,0 ± 0,5 g
22 0.775 mm 0,770 mm 0,754 mm 0,749 mm 19,8 ± 0,5 g
Table 9
3.8.2
Test pin for probe damage
Test pin for probe damage
Material: tool steel, hardened
Surface Roughness:
Ra = 0,8pm
Bending moment =
according to ISO Standard 468
Size 16 0,2260 Nm
Size 22 0,0141 Nm
3/4 Depth
7/2 Depth
Figure 16
Depth of engagement for test probe per TEC 512-8, test method 16a, paragraph 8.4b.
Contact size 3/4 Depth 7/2 Depth
Maximum L Minimum L Maximum I. Minimum I.
Size 16 5,791 mm 5,537 mm 3,912 mm 3,658 mm
Size 22 4,521 mm 4,267 mm 3,048 mm 2,794 mm
Table 10
Contact Size Test Pin for Probe Damage
Maximum OA Minimum 0A
16 1,600 mm 1,575 mm
22 0,775 mm 0,770 mm
3.8.3
Test gauge for restricted entry
Applied force = 22 N
>—0 A
12,7 mm Min.
Pin Length
Figure 17
Test procedure in accordance with IEC 512-8, test method 16b
Contact Size Test Pin for Restricted Entry
Maximum 0A Minimum 0A
16 1,892 mm 1,867 mm
22 0,902 mm 0,876 mm
Table 12
4. Characteristics
Climatic category
Performance level Climatic category lempcrature Damp heat Steady state
Lower ° C Upper ° C
1 55/125/56 -55°C 125° C 56 days
Tabic 13
4.2 Electrical
4.2.1 Creepage and clearance distances
The permissible operating voltages depend on the application and on the applicable or
specified safety requirements.
Therefore, the creepage and clearance distances arc given as operating characteristics.
In practice, reductions in crccpagc or clearance distances may occur due to the con-
ductive pattern of the printed board or the wiring used and shall be taken into account.
Minimum creepage and clearance distances
Minimum creepage and clearance distances Distance in mm
AC line to ground 3.2 min
AC neutral to ground 3.2 min
AC line to signal or DC output 6.4 min
AC neutral to signal or DC output 6.4 min
AC line to AC neutral 2.5 min
AC ground to signal or DC output 2.0 min
Table 14
4.2.2
Voltage proof
Conditions:
Voltage Proof:
TEC 60512-2, Test 4a Method В
Standard atmospheric conditions
Mated connectors
Test Voltage
AC contacts - 3,000 volts r.m.s.
DC contacts - 1,500 volts
Signal contacts - 1,000 volts
There shall be no breakdown or flashover.
4.2.3 Current carrying capacity
Conditions: IEC 60512-3, Test 5a
Standard atmospheric conditions
AH power contacts under load
The mated set of connectors (specimens) shall be composed of a
free-board connector with right angle solder terminations and a
fixed-board connector having press-in terminations.
Current carrying capacity curves
Curve A DC Power contacts No. 1 -20
Curve В AC Power contacts No. 45-47
Table 15
Curves shall be developed using two separate power supplies, one power supply for
each curve. All contacts under load during the test. The two power circuits are ener-
gized simultaneously.
Point of temperature measurement shall be on the contacts at the mating interface of the
male and female contacts. See Figure shown below for thermocouple placement.
Connector Insulator /—Thermocouple Placement Jpk Z— Д —z//Z< —Connector Insulator Figure 18
4.2.3
Current carrying capacity (cont’d)
TEMPERATURE RISE
CURVE A CURVE В
DC CONTACTS AC C ONTACTS
4.2.4
Contact resistance
Conditions:
IEC 60512-2, Test 2b
Standard atmospheric conditions
Mated connectors
Connection points
The mated set of connectors (specimens) shall be com-
posed of a free-board connector with right angle solder
terminations and a fixed-board connector having press-in
terminations.
Free Board Connector
Fixed Board Connector
Figure 20 - Connection points
Initial Contact Resistance
Connection Points
Contact size Initial value 60512-2 Test 2b Test Current values 60512-2 Test 2a Test Current values
Size 16 power < 0.7 mQ I5A
Size 22 power < 4.0 m£2 2A
Size 22 signal < 4.0 mQ < 1A
4.2.5
Insulation resistance
Conditions:
IEC 60512-2, Test 3a: Method В
Standard atmospheric conditions
Test voltage 100 V ± 15 V de
Mated connectors
Insulation resistance: > 10^ Q
4.3 Mechanical
4.3.1 Mechanical operation
Conditions:
IEC 60512-5, Test 9a
Standard atmospheric conditions
Speed 10 mm/s maximum
Rest 10 s minimum unmated
Performance level 1 — 250 operations
4.3.2 Insertion and withdrawal forces
Conditions:
IEC 60512-7, Test 13b
Standard atmospheric conditions
Maximum speed 10 mm/scc
Forces < 100 N
4.3.3 Contact retention in insert
Conditions:
Requirements:
IEC 60512-8, Test 15a
Standard atmospheric conditions
The connector shall be unmated and mounted in a suitable
fixture to hold the connector while the test is conducted.
All termination posts shall be free, in order to have no
influence on the test.
The force shall be applied axially to the contact, once in
mating and once in unmating direction
Apply a preload force of 13N to displace normal axial
float of contact before measurement. Then apply test
force in accordance with table on page 74.
4.3.3 Contact retention in insert (cont’d)
Contact size Force Applied Maximum displacement allowed after removal of test force
* Size 16 power contact all terminations types 45N 0,25 mm
Size 22 signal contact all termination types 27N 0,25 mm
Tabic 17
* Crimp removable contacts for pass-through terminations may be tested in accor-
dance with test schedule for closed crimp barrel contacts, clause 7.1 publication IEC
60807-7.
4.3.4 Contact bending strength
Conditions: IEC 60512-8, Test 16c
Standard atmospheric conditions
Maximum rate of applications of force: not to exceed 25,4
mm per minute.
Maximum time of force application: not to exceed 1
minute.
Size of contact Torque applied Maximum allowable permanent set
Size 16 Power 0.226 Nm 0,127 mm
Size 22 Signal 0.025 Nm 0.127 mm
Table 18
4.3.5 Static load, transverse
Conditions: IEC 60512-5, Test 8a Standard atmospheric conditions The connectors shall be unmated and mounted on a print- ed board Application points per clause 5.1.3
Forces: Fl = 100N, F2 = 75N, F3 = 50N
Requirements: After removal of the applied forces, there shall be no dis placement of the connector on the printed board, which could impair normal operation.
4.3.6 Vibration (sinusoidal)
Conditions: IEC 60512-4, Test 6d Standard atmospheric conditions Mated connectors The fixed and free board connector shall be rigidly installed in a suitable fixture as specified in clause 4.1.2
Vibration severity: PL1: 10 to 2000 Hz and 1,5 mm or 20 g
4.3.7 Shock
Conditions: IEC 60512-4, Test 6c Standard atmospheric conditions Mated connectors The fixed and free board connector shall be rigidly installed in a suitable fixture per clause 5.1.2
Performance level Severity Requirement
PL 1 Shock acceleration 490 m/s2. Duration of impact 11 ms. Five shocks in two directions per axis. Three axes. Duration of contact disturbance 1 ps max.
Table 19
Test schedule
General
This test schedule shows all tests and the order in which they shall be carried out
as well as the requirements to be met.
An “X” in the column “Requirements” of the following tables indicates that the
test or conditioning shall be applied.
Unless otherwise specified, mated sets of connectors shall be tested. Care shall
be taken to keep a particular combination of connectors together during the com-
plete test sequence, i.e. when unmating is necessary for a certain test, the same
connectors as before shall be mated for the subsequent tests.
In the following a mated set of connectors is called a “specimen.” A specimen is
defined as the mated set of connectors that shall be composed of a free-board
connector with right angle solder terminations and a fixed-board connector hav-
ing press-in terminations.
When the initial tests have been completed, all the specimens are divided up
according to the test groups. Before testing commences, the connectors must
have been stored for at least 24 hours in the uncoupled state under normal cli-
matic conditions for testing as per IEC 60068-1.
The following specimens are necessary for the entire inspection and test
sequence.
Number of specimens
Test Group Number of specimens
Performance Level PL1
P 30
AP 6
BP 8
CP 4
DP 4
EP 4
FP 4
5.1.1
Arrangement for contact resistance measurement
Conditions: IEC 60512-2, Test 2b
The mated set of connectors (specimens) shall be composed of a
free-board connector with right angle solder terminations and a
fixed-board connector having press-in terminations.
The measurement of contact resistance shall be carried out on the number of
contacts specified. Any subsequent measurements of contact resistance shall be
made on the same contacts.
Free Board Connector
Fixed Board Connector
Figure 21 - Connection points
Connection Points
5.1.2 Arrangement for dynamic stress tests
Conditions: IEC 60512-4 - Tests 6c and 6d
j
Fixed and free board connectors shall be rigidly installed in the fixture
I
i
I
)
25 min.
With Those Stated In Clause 5.1.7
Figure 22 - Dynamic stress tests arrangements
Arrangement for testing static load, transverse
Conditions: IEC 60512-5, Test 8a
Forces to be applied in the middle of the connector module
Application tool: 0 3 mm, rounded
Forces:Fl = 100N, F2 = 75N, F3 = 50N
Figure 23 - Arrangement for static load, transverse test
^O1^pact pQp
°CpOber 1999
Pa8e 81 of 92
5.1.6
Planaritv of mounted connectors
1)
Free Board Connector
1)
Figure 26 - Planarity of mounted connectors
1) Valid for total height (concave and convex direction)
2) Dimensions for printed boards per clause 5.1.7
Test printed board for fixed and free board connectors
For use with connectors tested per clauses 5.1.2 and 5.1.6
U i/ioo
3,2
75 -1
150
Fixed Connector
Printed Board
U i/ioo
Figure 27 - Test printed boards for fixed and free board connectors
Dimensions see clauses 2.3.1 and 3.6.1
Dimensions sec clauses 2.3.2 and 3.7.1
Free Connector
Printed Board
5.2
Test Schedule Tables
5.2.1 Preliminary Group P
All specimens shall be subjected to the following tests in sequence:
Test Phase Test Measurement to be performed Requirements
Title IEC 512 Test No. Severity or condition of test Title IEC 512 Test No. PL
PI General examination Unmatcd connectors Visual exam inafion la / X There shall be no defect that would impair normal operation
Dimensional examination lb 7 X The dimensions shall comply with those specified in 3, including creep- age and clearance distances per clause 4.2.1
P2 Polarizing method 13e Force to be applied: 1,5 x insertion force according to the max. insertion forces per clause 4.3.2 1 X It shall be possible to correctly align and mate the appropriate mating connectors. It shall not be possi- ble to mate the con- nectors in any other than the cor- rect manner.
P3 Connection points according to 5.1.1 6 contacts each of size 16 and size 22 contacts Contact resistance 2b 1 Size 16 contact < 0,7 mfi Size 22 contact < 4 mQ
P4 Test voltage 100V ± 15 V d.c. Method В 8 contacts / specimen per clause 5.1.4 Insulation resistance 3a 1 X > 10,0Q
P5 Contact/contact same measuring points as per clause 5.1.4 Method A Voltage proof 4a 1 X Per clause 4.2.2 No flashover
The specimens shall be divided into six groups. All connectors in each group shall
undergo the tests specified for the relevant group.
5.2.2
Group AP - Dynamic/Climatic
Test Phase Test Measurement to be performed Requirements
Title IEC 512 Test No Severity or condition of test Title IEC 512 Test No. PL
API Insertion and withdrawal forces 13b 1 X Requirements see 4.3.2
AP2 Female contacts only 10 contacts size 16 and 10 contacts size 22. Sizing and reten- tion force gauge per clause 3.8.1 Gauge retention force 16c X Retains gauge
AP3 Vibration 6d 10 Hz-2000Hz 1,5 mm resp. 20 g. Sweep cycles: 10 Full Duration: 6h Contact disturbance 2e 1 X 1 gs max.
Connection points per clause 5.1.1 6 contacts each of size 16 and size 22 contacts Contact resistance 2b X Size 16 contact < 1 mQ Size 22 contact < 6 mQ
AP4 Visual examination la I X No damage like- ly to impair nor- mal operation
AP5 Shock 6c Arrangement according to 5.1.2 Half sine Shock acceleration: 490 m/s^ (50 g) Duration of impact: 11 m/s Contact disturbance 2c 1 X 1 gs max.
Connection points per clause 5.1.1 6 contacts each of size 16 and size 22 contacts Contact resistance 2b 1 X Size 16 contact < 1 mQ Size 22 contact < 6 mQ
AP6 Visual examination la 1 X No damage like- ly to impair nor- mal operation
AP7 Acceleration steady state 6a Not Applicable Not Applicable
Not Applicable Not Applicable
AP8 Visual examination la 1 X No damage like- ly to impair nor- mal operation
AP9 Rapid change of tempera- ture lid -5 5 °C to 125°C Mated : 30 min. 5 cycles 1 X
AP10 Test voltage 100 V 15 Vd.c/ Method В 8 contacts / specimen per clause 5.1.4 Insulation resistance 3a 1 X > 10loQ
5.2.2
Group AP - Dynamic / Climatic (cont’d)
Test Phase Test Measurement to be performed Requirements
Title IEC 512 Test No Severity or condition of test Title IEC 512 Test No. PL
API 1 Contact/contact same measuring points as per clause 5.1.4 Method A Voltage 4a I X Per clause 4.2.2 No flashover
AP12 Visual examination la 1 X No damage like- ly to impair nor- mal operation
AP13 Climatic sequence Ila
AP 13.1 Dry heat Hi 125°C Duration: 16h lest voltauc 100V± 15 V d.c. Method В 8 contacts/spccimcn Insulation resistance at high temperature 3a 1 X >109Q
AP 13.2 Damp heat, cyclic, first cycle 1 Im Method 1 Recovery time 2h 55°C Visual examination la 1 X No damage like- ly to impair nor- mal operation
AP 13.3 Cold Hj -55° C Duration: 2h Recovery time 2h Visual examination la 1 X No damage like- ly to impair nor- mal operation
AP 13.4 Low air pressure Ilk Not Applicable Voltage proof 4a 1 X Not Applicable
AP 13.5 Damp halt, cyclic, remain- ing cycles 11m Conditions per AP 13.2 5 cycles Visual examination la 1 X No damage like- ly to impair nor- mal operation
AP14 Test voltage 100 V ± 15 V d.c. Method В 8 contacts / specimen per clause 5.1.4 Insulation resistance 3a I X > 10s Q
API5 Connection points per clause 5.1.1 6 contacts each of size 16 and size 22 contacts Contact resistance 2b 1 Size 16 contact < 1.7 mQ Size 22 contact < 6 mQ
AP16 Contact/contact same measuring points as per clause 5.1.4 Method A Voltage proof 4a X Per clause 4.2.2 No flashover
AP17 Insertion and withdrawal forces 13b 1 X Per clause 4.3.2
API 8 Unmated Visual examination la 1 X No damage like- ly to impair nor- mal operation
5.2.3
Group BP - Mechanical endurance
Test Phase Test Measurement to be performed Requirements
Title IEC 512 Test No Severity or condition of test Title TEC 512 Test No. PL
BPI Female contacts only 10 contacts size 16 and 10 contacts size 22. Sizing and retention force gauge per clause 3.8.1 Gauge retention force 16c 1 X Retains gauge
BP2 Mechanical operation - half of the specified number of operations 9a Speed 10 mm/s max. Rest 30 s (unmated) 1 125 operations
BP3 Unmatcd connectors Visual examination la 1 X No damage like- ly to impair nor- mal operation
BP4 Connection points per clause 5.1.1 6 contacts each of size 16 and size 22 contacts Contact resistance 2b 1 Size 16 contact < 1 mQ Size 22 contact < 6 mQ
BP5 Test voltaec 100 V± 15 V d.c. Method В S contacts/spccimcn per clause 5.1.4 Insulation resistance 3a 1 X > 10,()Q
BP6 Contact/contact same measuring points as per clause 5.1.4 Method A Voltage proof 4a 1 X Per clause 4.2.2 No flashover
BP7 Climatic test
BP 7.1 Corrosion, flowing mixed gas Hg Half mated/ half unmatcd Under consideration 1 X Under consideration
BP 7.2 Connection points per clause 5.1.1 6 contacts each of size 16 and size 22 contacts Contact resistance 2b X Under consideration
BPS Mechanical operation - remaining half of speci- fied number of operations 9a Speed 10 mm/s max. Rest 30 s (unmatcd) 1 X 125 operations
BP9 Unmatcd connectors Visual examination la 1 X No damage like- ly to impair nor- mal operation
BP10 Connection points per clause 5.1.1 6 contacts each of size 16 and size 22 contacts Contact resistance 2b 1 X Size 16 contact < 1 mQ Size 22 contact < 6 mQ
5.2.3
Group BP - Mechanical endurance (cont‘d)
Test Phase Test Measurement to be performed Requirements
Test Phase Title IEC 512 Test No Severity or condition of test Title IEC 512 Test No. PL
ВР11 Test voltaue 100 V± 1*5 Vd.c. Method В 8 contacts/specimcn per clause 5.1.4 Insulation resistance 3a 1 X > 1010Q
BPI2 C’ontact/contact same measuring points as per clause 5.1.4 Method A Voltage proof 4a 1 X Per clause 4.2.2 No flashover
BP13 Female contacts only 10 contacts size 16 and 10 con- tacts size 22. Sizing and retention force sauce per clause 5.8.1 Gauge retention force 16c 1 X Retains gauge
BP14 Static load, transverse 8a Application points per clause 5.1.3 Applied Forces: per clause 4.3.5 1 X There shall be no displacement of the connector on the printed board which could impair normal operation
Group CP - Moisture
Test Phase Test Test Measurement to be performed Requirements
Title IEC 512 Test No Severity or condition of test Title IEC 512 Test No. PL
CPI Damp heat, steady heat lie Un mated non opera- tional Recovery time: 2h Conditions per clause 4.1 1 56 days
CP2 'lest voltage 100 V± 15 Vd.c. Method В 8 contacb/spccimcn per clause 5.1.4 Insulation resistance 3a 1 > 108Q
CP3 Connection points according to 5.1.1 6 contacts each of size 16 and size 22 contacts Contact resistance 2b I Size 16 contact < 2.2 mQ Size 22 contact < 7 mil
CP4 Contact/contact same measuring points as per clause 5.1.4 Method A Voltage ргооГ 4a X Per clause 4.2.2 No flashover
CP5 Insertion and withdrawal forces 13b 1 X Per clause 4.3.2
CP6 Visual examination la 1 X No damage likely to impair normal operation
5.2.5 Group DP - Electrical load
Test Phase Test Measurement to be performed Requirements
Title IEC 512 Test No Severity or condition of test Title IEC 512 Test No. PL
DPI Mechanical operation (number of operations as specified for BP2) 9a Speed 10 mm/s max. Rest 30s (unmated) 1 X 125 operations
DP2 Electrical load and temperature 9b Duration: lOOOh Recovery Time: 2h Ambient tempera- ture: 70° C Current load - DC output power con- tacts No. 1-20 16 amps each input power contacts No. 45-47 23 amps each contacts No. 21,22, 24 2 amps each, signal contacts not loaded. 1 X
DP3 Connection points per clause 5.1.1 6 contacts each of size 16 and size 22 contacts Contact resistance 2b 1 X Size 16 contact < 2.2 mQ Size 22 contact <9mQ
DP4 Test voltage 100 V ± 15 V d.c. Method В 8 contacts/spccimcn per clause 5.1.4 Insulation resistance 3a 1 X 103 MQ minimum
DP5 C ontact/contact same measuring points as per clause 5.1.4 Method A Voltage proof 4a 1 X Per clause 4.2.2 No flashover
DP6 Visual examination la 1 There shall be no damage that would impair normal operation
DP7 Not Applicable Partial discharge 4b 1 X Not Applicable
5.2.6 Group EP - Mechanical resistivity
Test Phase Test Measurement to be performed Requirements
Title IEC 512 Test No Severity or condition of test Title IEC 512 Test No. PL
EPI Robustness of terminations 16Г Not Applicable Not Applicable
EP2 Contact retention in insert 15a 6 contacts each of size 16 and size 22 contacts per specimen Axial force to be applied in both directions X Maximum dis- placement per requirements per clause 4.3.3
EP3 Probe damage 16a Female contacts only 10 contacts size 16 and 10 contacts size 22 Test probe per sub- clausc 3.8.2 Gauge retention force 16c X Retains gauge
EP4 Restricted entry 16b Female contacts only 10 contacts size 16 and 10 con- tacts size 22 Test probe per clause 3.8.2 Test gauge shall not enter the contact
EP5 Contact bending strength 16c Male contacts only 10 contacts size 16 and 10 contacts size 22 I X Permanent set values per clause 4.3.4
EP6 Visual examination la 1 X Not applicable
EP7 Flammability 20a One unmatcd speci- men arrangement per clause 5.1.5 Flame exposure time 10s X Post burning time 10 s max
EPS Visual examination la 1 X Insulator material sclf-cxtinguish- ing
5.2.7
Group FP - Chemical resistivity
Test Phase Test Measurement to be performed Requirements
Title IEC 512 Test No Severity or eondition of lest Title IEC 512 Test No. PL
FP1 Resistance to fluids, solvents (u.c.) 1 X under consideration
FP2 Insertion and with- drawal forces 13b 1 X
FP3 Connection points per clause 5.1.1 6 contacts each of size 16 and size 22 contacts per speci- men Contact resistance 2b 1 X
FP4 Test voltage 100 V± 15 Vd.c. Method В 8 contacts/spccimcn per clause 5.1.4 Insulation resistance 3a 1 X
FP5 General examination See PI Visual examination la 1
6. Quality assessment procedures under consideration
7. Revision History
7 Revision History
This chapter documents the changes made to the CompactPCI Power Interface Specification.
Table 12 Revision History.
Revision Date Description
Draft 1.0 May 24, 1999 Final draft for subcommittee ballot
R 1.0 September 10, 1999 Draft for Executive Committee ballot
R 1.0 October 1, 1999 Released Version